Capital Advanced Technologies, Inc.
- Capital Advanced Technologies is a leading manufacturer of products for prototype development and fabrication. Surfboards® surface mount breadboards and adaptors offer support for a wide range of surface mount devices and circuit configurations. Uni-Sip™ breadboards provide a modular solution for circuit construction with through hole components. Together these products extend the range of conventional breadboarding techniques to include new component technologies and provide more efficient interconnectivity.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 1000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 7
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.500" L x 0.700" W (12.70mm x 17.80mm)
0
50 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 1000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 8
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.500" L x 0.800" W (12.70mm x 20.30mm)
0
18 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 1000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 9
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.500" L x 0.900" W (12.70mm x 22.90mm)
0
11 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 1000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 10
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.500" L x 1.000" W (12.70mm x 25.40mm)
0
100 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 2000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 6
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.598" L x 0.598" W (15.20mm x 15.20mm)
0
41 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 2000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 7
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.598" L x 0.701" W (15.20mm x 17.80mm)
0
7 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 2000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 8
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.598" L x 0.800" W (15.20mm x 20.30mm)
0
14 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 2000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 10
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.598" L x 1.000" W (12.70mm x 25.40mm)
0
35 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 2000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 12
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 0.598" L x 1.201" W (15.20mm x 30.50mm)
0
11 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 3000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 8
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 0.799" W (25.40mm x 20.30mm)
0
29 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 3000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 10
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.000" W (25.40mm x 25.40mm)
0
11 in stock
Capital Advanced Technologies, Inc.
Manufacturer : Capital Advanced Technologies
Series : 3000, UNI-SIP™
Part Status : Active
Proto Board Type : Through Hole to SIP
Package Accepted : Non Specific
Number of Positions : 12
Pitch : -
Board Thickness : 0.031" (0.79mm) 1/32"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" L x 1.201" W (25.40mm x 30.50mm)
0
51 in stock
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