Chip Quik, Inc.
- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.
Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.
Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.008" (0.20mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 32 AWG, 35 SWG
Process : Lead Free
Form : Spool, 1.76 oz (50g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
20 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 27 AWG, 28 SWG
Process : Lead Free
Form : Tube, 0.3 oz (8.51g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
91 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 27 AWG, 28 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
16 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : -
Process : Lead Free
Form : Spool, 1 oz (28.35g)
Shelf Life : -
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : -
0
47 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : -
Process : Lead Free
Form : Spool, 2 oz (56.70g)
Shelf Life : -
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : -
0
48 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : -
Process : Lead Free
Form : Spool, 4 oz (113.40g)
Shelf Life : -
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : -
0
50 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.015" (0.38mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 27 AWG, 28 SWG
Process : Lead Free
Form : Spool, 8 oz (227g), 1/2 lb
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
73 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : SMD
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Tube, 0.4 oz (11.34g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
85 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean, Water Soluble
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Spool, 1 lb (454 g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
17 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Spool, 1 oz (28.35g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
173 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Spool, 2 oz (56.70g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
76 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Wire Solder
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : 0.020" (0.51mm)
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : 24 AWG, 25 SWG
Process : Lead Free
Form : Spool, 4 oz (113.40g)
Shelf Life : Not Applicable
Shelf Life Start : -
Storage/Refrigeration Temperature : -
0
228 in stock
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