Chip Quik, Inc.
- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.
Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.
Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.
Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 484
Pitch : 0.050" (1.27mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : -
Thermal Center Pad : -
0
3 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 42
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 2.100" (17.78mm x 53.34mm)
0
100 in stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 42
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
1 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 25
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 1.300" (17.78mm x 33.02mm)
0
100 in stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 25
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 54
Pitch : 0.047" (1.20mm)
Board Thickness : -
Material : -
Size / Dimension : -
0
100 in stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 54
Pitch : 0.047" (1.20mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 54
Pitch : 0.029" (0.75mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.700" (25.40mm x 68.58mm)
0
100 in stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 54
Pitch : 0.029" (0.75mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to PGA
Package Accepted : BGA
Number of Positions : 100
Pitch : 0.026" (0.65mm)
Board Thickness : 0.063" (1.60mm)
Material : FR4 Epoxy Glass
Size / Dimension : 1.900" x 1.900" (48.26mm x 48.26mm)
0
100 in stock
Chip Quik, Inc.
Type : BGA
Number of Positions : 100
Pitch : 0.026" (0.65mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 25
Pitch : 0.016" (0.40mm)
Board Thickness : -
Material : -
Size / Dimension : -
0
100 in stock
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