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Part Number
Manufacturer
Description
Unit Price
In Stock
EPC2112ENGRT
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : -
Part Status : Active
Output Configuration : Low Side
Applications : DC-DC Converters
Interface : On/Off
Load Type : Inductive
Technology : MOSFET (Metal Oxide)
Rds On (Typ) : 32 mOhm
Current - Output / Channel : 10A
Current - Peak Output : 40A
Voltage - Supply : 4.5 V ~ 5.5 V
Voltage - Load : 4.5 V ~ 5.5 V
Operating Temperature : -40°C ~ 150°C (TJ)
Features : -
Fault Protection : -
Mounting Type : Surface Mount
Package / Case : 10-XFBGA
Supplier Device Package : 10-BGA (2.9x1.1)
Packaging : Cut Tape (CT)
Alternate Packaging
Series : -
Part Status : Active
Output Configuration : Low Side
Applications : DC-DC Converters
Interface : On/Off
Load Type : Inductive
Technology : MOSFET (Metal Oxide)
Rds On (Typ) : 32 mOhm
Current - Output / Channel : 10A
Current - Peak Output : 40A
Voltage - Supply : 4.5 V ~ 5.5 V
Voltage - Load : 4.5 V ~ 5.5 V
Operating Temperature : -40°C ~ 150°C (TJ)
Features : -
Fault Protection : -
Mounting Type : Surface Mount
Package / Case : 10-XFBGA
Supplier Device Package : 10-BGA (2.9x1.1)
0
831 in stock
EPC2115ENGRT
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : -
Part Status : Active
Output Configuration : Low Side
Applications : DC-DC Converters
Interface : On/Off
Load Type : Inductive
Technology : MOSFET (Metal Oxide)
Rds On (Typ) : 70 mOhm
Current - Output / Channel : 5A
Current - Peak Output : 18A
Voltage - Supply : 4.5 V ~ 5.5 V
Voltage - Load : 4.5 V ~ 5.5 V
Operating Temperature : -40°C ~ 150°C (TJ)
Features : -
Fault Protection : -
Mounting Type : Surface Mount
Package / Case : 10-VFBGA
Supplier Device Package : 10-BGA (2.9x1.1)
Packaging : Cut Tape (CT)
Alternate Packaging
Series : -
Part Status : Active
Output Configuration : Low Side
Applications : DC-DC Converters
Interface : On/Off
Load Type : Inductive
Technology : MOSFET (Metal Oxide)
Rds On (Typ) : 70 mOhm
Current - Output / Channel : 5A
Current - Peak Output : 18A
Voltage - Supply : 4.5 V ~ 5.5 V
Voltage - Load : 4.5 V ~ 5.5 V
Operating Temperature : -40°C ~ 150°C (TJ)
Features : -
Fault Protection : -
Mounting Type : Surface Mount
Package / Case : 10-VFBGA
Supplier Device Package : 10-BGA (2.9x1.1)
0
917 in stock
EPC2202
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q101, eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 80V
Current - Continuous Drain (Id) @ 25°C : 18A
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 17 mOhm @ 11A, 5V
Vgs(th) (Max) @ Id : 2.5V @ 3mA
Gate Charge (Qg) (Max) @ Vgs : 4nC @ 5V
Vgs (Max) : +5.75V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 415pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die Outline (6-Solder Bar)
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q101, eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 80V
Current - Continuous Drain (Id) @ 25°C : 18A
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 17 mOhm @ 11A, 5V
Vgs(th) (Max) @ Id : 2.5V @ 3mA
Gate Charge (Qg) (Max) @ Vgs : 4nC @ 5V
Vgs (Max) : +5.75V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 415pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die Outline (6-Solder Bar)
Package / Case : Die
0
29169 in stock
EPC2203
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q101, eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 80V
Current - Continuous Drain (Id) @ 25°C : 1.7A
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 80 mOhm @ 1A, 5V
Vgs(th) (Max) @ Id : 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs : 0.83nC @ 5V
Vgs (Max) : +5.75V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 88pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q101, eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 80V
Current - Continuous Drain (Id) @ 25°C : 1.7A
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 80 mOhm @ 1A, 5V
Vgs(th) (Max) @ Id : 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs : 0.83nC @ 5V
Vgs (Max) : +5.75V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 88pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
0
29131 in stock
EPC8002
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 65V
Current - Continuous Drain (Id) @ 25°C : 2A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 530 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : -
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 21pF @ 32.5V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 65V
Current - Continuous Drain (Id) @ 25°C : 2A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 530 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : -
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 21pF @ 32.5V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
0
49379 in stock
EPC8004
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 40V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 110 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.45nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 52pF @ 20V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 40V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 110 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.45nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 52pF @ 20V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
0
5152 in stock
EPC8009
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 65V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 130 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.45nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 52pF @ 32.5V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 65V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 130 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.45nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 52pF @ 32.5V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
0
6917 in stock
EPC8010
EPC
Manufacturer : EPC
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 100V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 160 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.48nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 55pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
Packaging : Cut Tape (CT)
Alternate Packaging
Series : eGaN®
Part Status : Active
FET Type : N-Channel
Technology : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 100V
Current - Continuous Drain (Id) @ 25°C : 2.7A (Ta)
Drive Voltage (Max Rds On, Min Rds On) : 5V
Rds On (Max) @ Id, Vgs : 160 mOhm @ 500mA, 5V
Vgs(th) (Max) @ Id : 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs : 0.48nC @ 5V
Vgs (Max) : +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds : 55pF @ 50V
FET Feature : -
Power Dissipation (Max) : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : Die
Package / Case : Die
0
11806 in stock
EPC9001
EPC
Manufacturer : EPC
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2015
Primary Attributes : 40V, 15A Max Output GaNFET Capability
Supplied Contents : Board(s)
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2015
Primary Attributes : 40V, 15A Max Output GaNFET Capability
Supplied Contents : Board(s)
0
2 in stock
EPC9001C
EPC
Manufacturer : EPC
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2015C
Primary Attributes : -
Supplied Contents : Board(s)
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2015C
Primary Attributes : -
Supplied Contents : Board(s)
0
12 in stock
EPC9002C
EPC
Manufacturer : EPC
Series : eGaN®
Part Status : Active
Type : Power Management
Function : *
Embedded : -
Utilized IC / Part : EPC2001C
Primary Attributes : -
Supplied Contents : Board(s)
Series : eGaN®
Part Status : Active
Type : Power Management
Function : *
Embedded : -
Utilized IC / Part : EPC2001C
Primary Attributes : -
Supplied Contents : Board(s)
0
16 in stock
EPC9003C
EPC
Manufacturer : EPC
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2010C
Primary Attributes : -
Supplied Contents : Board(s)
Series : eGaN®
Part Status : Active
Type : Power Management
Function : Half H-Bridge Driver (External FET)
Embedded : No
Utilized IC / Part : EPC2010C
Primary Attributes : -
Supplied Contents : Board(s)
0
34 in stock
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