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t-Global Technology

- t-Global Technology is a leading manufacturer and supplier of thermal management solutions. t-Global manufactures materials in their state of art facilities in Taiwan and the UK. Their broad product portfolio covers silicone and non-silicone gap fillers, silicone and non-silicone putties, ceramic heat spreaders, combined thermal and EMI absorbers and a wide selection of die-cut insulators. Taiwan is the central location for new product development and research and the UK takes responsibility for complex engineering projects, rapid prototyping and dispensing technology. t-Global’s philosophy is based around a very short lead-time and low MOQ’s, which translates into rapid prototyping and a short time to market.

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Part Number
Manufacturer
Description
Unit Price
In Stock

TI900-300-300-0.12-0 TI900-300-300-0.12-0

t-Global Technology
Manufacturer : t-Global Technology
Series : Ti900
Part Status : Active
Usage : -
Type : Conductive Insulator Pad
Shape : Square
Outline : 300.00mm x 300.00mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : -
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
0
11 in stock

TI900-30-30-0.12 TI900-30-30-0.12

t-Global Technology
Manufacturer : t-Global Technology
Series : Ti900
Part Status : Active
Usage : -
Type : Conductive Insulator Pad
Shape : Square
Outline : 30.00mm x 30.00mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : -
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
0
77 in stock

TI900-40-30-0.12-1A TI900-40-30-0.12-1A

t-Global Technology
Manufacturer : t-Global Technology
Series : Ti900
Part Status : Active
Usage : -
Type : Conductive Insulator Pad
Shape : Rectangular
Outline : 40.00mm x 30.00mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : Adhesive - One Side
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
0
100 in stock

TI900-50M-320-0.12 TI900-50M-320-0.12

t-Global Technology
Manufacturer : t-Global Technology
Series : Ti900
Part Status : Active
Usage : -
Type : Conductive Insulator Pad, Roll
Shape : Rectangular
Outline : 50.00m x 320.00mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : -
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
0
100 in stock

XL25-10-10-2 XL25-10-10-2

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
5120 in stock

XL25-20-20-2 XL25-20-20-2

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
5133 in stock

XL25-30-30-2 XL25-30-30-2

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.181" (30.00mm)
Width : 1.181" (30.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
448 in stock

XL25-40-40-2 XL25-40-40-2

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.079" (2.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
260 in stock

XL25-40-40-3 XL25-40-40-3

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : -
Shape : Square
Length : 1.575" (40.00mm)
Width : 1.575" (40.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.118" (3.00mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
3110 in stock

XLI98-10-2.25-P XLI98-10-2.25-P

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
100 in stock

XLI98-20-2.25-P XLI98-20-2.25-P

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.787" (20.00mm)
Width : 0.787" (20.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.089" (2.25mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
2343 in stock

XLI98C-10-2.15-P XLI98C-10-2.15-P

t-Global Technology
Manufacturer : t-Global Technology
Series : XL-25
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square
Length : 0.394" (10.00mm)
Width : 0.394" (10.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.085" (2.15mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Ceramic
Material Finish : -
0
100 in stock