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- Connectors, Interconnects
- Sockets for ICs, Transistors
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Part Number
Manufacturer
Description
Unit Price
In Stock
24-C182-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : EJECT-A-DIP™
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : EJECT-A-DIP™
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
52 in stock
25-0503-30
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 0503
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Wire Wrap
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA), Nylon, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 0503
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Wire Wrap
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA), Nylon, Glass Filled
Operating Temperature : -
0
313 in stock
25-0511-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 511
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : 511
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
104 in stock
25-0513-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 0513
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 0513
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1356 in stock
251-5949-01-0602
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid) : 51 (1 x 25, 1 x 26)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid) : 51 (1 x 25, 1 x 26)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
20 in stock
251-5949-02-0602
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid) : 51 (1 x 25, 1 x 26)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid) : 51 (1 x 25, 1 x 26)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
13 in stock
256-1292-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 56 (2 x 28)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 56 (2 x 28)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
85 in stock
256-4205-01
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 56 (4 x 14)
Pitch - Mating : 0.016" (0.40mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.016" (0.40mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 56 (4 x 14)
Pitch - Mating : 0.016" (0.40mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.016" (0.40mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
0
12 in stock
260-4204-01
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 60 (4 x 15)
Pitch - Mating : 0.016" (0.40mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.016" (0.40mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 60 (4 x 15)
Pitch - Mating : 0.016" (0.40mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.016" (0.40mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
0
50 in stock
264-1300-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid) : 64 (2 x 32)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.070" (1.78mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid) : 64 (2 x 32)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.070" (1.78mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
261 in stock
264-4493-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid) : 64 (2 x 32)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid) : 64 (2 x 32)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
40 in stock
264-5205-01
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 64 (4 x 16)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.020" (0.50mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 64 (4 x 16)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.020" (0.50mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
0
26 in stock
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