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Part Number
Manufacturer
Description
Unit Price
In Stock
PH3-150-150-0.21-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Square
Length : 5.906" (150.00mm)
Width : 5.910" (150.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Square
Length : 5.906" (150.00mm)
Width : 5.910" (150.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
39 in stock
PH3-50.8-12.7-0.21-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
100 in stock
PH3-76.2-12.7-0.21-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
31 in stock
PH3-76.2-19.1-0.21-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.750" (19.05mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.750" (19.05mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
75 in stock
PH3-76.2-25.4-0.21-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.008" (0.21mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
14 in stock
PH3N-101.6-25.4-0.062-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
7 in stock
PH3N-101.6-25.4-0.07-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.000" (25.40mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
7 in stock
PH3N-101.6-38.1-0.062-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.500" (38.10mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.500" (38.10mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
65 in stock
PH3N-101.6-38.1-0.07-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.500" (38.10mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 4.000" (101.60mm)
Width : 1.500" (38.10mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
100 in stock
PH3N-50.8-12.7-0.062-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
100 in stock
PH3N-50.8-12.7-0.07-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 2.000" (50.80mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.003" (0.07mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
25 in stock
PH3N-76.2-12.7-0.062-1A
t-Global Technology
Manufacturer : t-Global Technology
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
Series : PH3n
Part Status : Active
Type : Heat Spreader
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Adhesive
Shape : Rectangular
Length : 3.000" (76.20mm)
Width : 0.500" (12.70mm)
Diameter : -
Height Off Base (Height of Fin) : 0.002" (0.06mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : Copper
Material Finish : Polyester
0
100 in stock
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