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Part Number

Manufacturer

Description

Unit Price

In Stock

A16367-08

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Rectangular
Outline : 228.60mm x 215.90mm
Thickness : 0.0800" (2.032mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

63 in stock

A16367-09

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0900" (2.286mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-10

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Rectangular
Outline : 228.60mm x 228.60mm
Thickness : 0.100" (2.54mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

3 in stock

A16367-11

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.110" (2.79mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-12

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.120" (3.05mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-13

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.130" (3.30mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-14

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.140" (3.56mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-43

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0300" (0.762mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-44

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0400" (1.016mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-45

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0500" (1.270mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16367-46

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™SF600
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0600" (1.524mm)
Material : Non-Silicone, Boron Nitride Filled
Adhesive : -
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K

100 in stock

A16486-03

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HR200
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0300" (0.762mm)
Material : Silicone Elastomer
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 1.6 W/m-K

100 in stock