228-7396-55-1902
228-7396-55-1902
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
Availability: 100 in stock
New Original Stock
Competitive Prices
One-stop
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