24-6554-16
24-6554-16
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Nickel Boron
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Nickel Boron
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
Availability: 60 in stock
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