25-0503-30
25-0503-30
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 0503
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 25 (1 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Wire Wrap
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA), Nylon, Glass Filled
Operating Temperature : -
Availability: 313 in stock
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