28-526-11
28-526-11
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 125°C
Availability: 59 in stock
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