44-547-11
44-547-11
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 547
Part Status : Active
Type : SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid) : 44 (2 x 22)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
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