BDN18-3CB/A01
BDN18-3CB/A01
Manufacturer : CTS Thermal Management Products
Series : BDN
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Pin Fins
Length : 1.810" (45.97mm)
Width : 1.810" (45.97mm)
Diameter : -
Height Off Base (Height of Fin) : 0.355" (9.02mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 3.50°C/W @ 400 LFM
Thermal Resistance @ Natural : 10.80°C/W
Material : Aluminum
Material Finish : Black Anodized
Availability: 1500 in stock
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