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BDN18-6CB/A01

BDN18-6CB/A01
Manufacturer : CTS Thermal Management Products
Series : BDN
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Pin Fins
Length : 1.810" (45.97mm)
Width : 1.810" (45.97mm)
Diameter : -
Height Off Base (Height of Fin) : 0.605" (15.37mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 2.80°C/W @ 400 LFM
Thermal Resistance @ Natural : 8.10°C/W
Material : Aluminum
Material Finish : Black Anodized
Availability: 1023 in stock
RFQ/Quote