Welcome to Weijie Semiconductor

A17156-11

A17156-11
Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD300
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.110" (2.79mm)
Material : Silicone Elastomer
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 2.7 W/m-K
Availability: 2 in stock
RFQ/Quote