Welcome to Weijie Semiconductor

A17174-11

A17174-11
Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™P300
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.110" (2.79mm)
Material : Elastomer
Adhesive : -
Backing, Carrier : Liner
Color : Purple
Thermal Resistivity : -
Thermal Conductivity : 3.0 W/m-K
Availability: 2 in stock
RFQ/Quote