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PA-SSD3SM18-16

Manufacturer: Logical Systems
PA-SSD3SM18-16
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 0.850" L x 0.450" W (21.59mm x 11.43mm)
Availability: 134 in stock
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