PA-SSD3SM18-18
PA-SSD3SM18-18
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 18
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 0.950" L x 0.950" W (24.13mm x 11.43mm)
Availability: 14 in stock