PA-SSD3SM18-20
PA-SSD3SM18-20
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 20
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.050" L x 0.450" W (26.67mm x 11.43mm)
Availability: 220 in stock