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Picture of 69-11-42342-T777

69-11-42342-T777

Manufacturer: Parker Chomerics
69-11-42342-T777
Manufacturer : Parker Chomerics
Series : THERMFLOW® T777
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 152.40mm x 152.40mm
Thickness : 0.0045" (0.115mm)
Material : Polymer Solder Hybrid
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : -
Availability: 45 in stock
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