Welcome to Weijie Semiconductor
Image
Part Number
Manufacturer
Description
Unit Price
In Stock

PA0149 PA0149

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LLP
Number of Positions : 60
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 3.000" (25.40mm x 76.20mm)
0
100 in stock

PA0150 PA0150

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LLP
Number of Positions : 64
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 3.200" (25.40mm x 81.28mm)
0
100 in stock

PA0151 PA0151

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LLP
Number of Positions : 68
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 3.400" (25.40mm x 86.36mm)
0
100 in stock

PA0152 PA0152

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 4
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.200" (17.78mm x 5.08mm)
0
100 in stock

PA0153 PA0153

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 5
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.300" (17.78mm x 7.62mm)
0
100 in stock

PA0154 PA0154

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 6
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.300" (17.78mm x 7.62mm)
0
100 in stock

PA0155 PA0155

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 8
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
100 in stock

PA0157 PA0157

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.500" (17.78mm x 12.70 mm)
0
100 in stock

PA0159 PA0159

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MicroSMD, BGA
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.700" (17.78mm x 17.78mm)
0
100 in stock

PA0168 PA0168

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
115 in stock

PA0169 PA0169

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.500" (17.78mm x 12.70mm)
0
100 in stock

PA0170 PA0170

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC EP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
100 in stock