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Part Number

Manufacturer

Description

Unit Price

In Stock

PA0240

Chip Quik, Inc.

Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LQFP
Number of Positions : 48
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.400" (25.40mm x 60.96mm)

47 in stock

PA0241

Chip Quik, Inc.

Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TQFP
Number of Positions : 52
Pitch : 0.039" (1.00mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.600" (25.40mm x 66.04mm)

100 in stock

PA0242

Chip Quik, Inc.

Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : PLCC
Number of Positions : 16
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.800" (17.78mm x 20.32mm)

100 in stock

PA0243

Chip Quik, Inc.

Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : BGA
Number of Positions : 4
Pitch : 0.031" (0.80mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.200" (17.78mm x 5.08mm)

100 in stock

PA0244

Chip Quik, Inc.

Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TO-252 (DPAK)
Number of Positions : 5
Pitch : 0.045" (1.14mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.500" (17.78mm x 12.70mm)

100 in stock

PA44QL8-1D

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFP
Number of Positions : 44
Pitch : -
Board Thickness : -
Material : -
Size / Dimension : -

14 in stock

PA-MSD3SM18-08

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MSOP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 0.450" L x 0.450" W (11.43mm x 11.43mm)

344 in stock

PA-MSD3SM18-10

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MSOP
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Board Thickness : -
Material : -
Size / Dimension : 0.450" L x 0.550" W (11.43mm x 13.97mm)

102 in stock

PA-QLD6SM18-32F-88

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN, QFN
Number of Positions : 32
Pitch : 0.031" (0.80mm)
Board Thickness : -
Material : -
Size / Dimension : 1.650" L x 0.750" W (41.91mm x 19.05mm)

1 in stock

PA-QSD3SM18-16

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QSOP
Number of Positions : 16
Pitch : 0.025" (0.64mm)
Board Thickness : -
Material : -
Size / Dimension : 0.850" L x 0.450" W (21.59mm x 11.43mm)

14 in stock

PA-QSD3SM18-20

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QSOP
Number of Positions : 20
Pitch : 0.025" (0.64mm)
Board Thickness : -
Material : -
Size / Dimension : 1.050" L x 0.450" W (26.67mm x 11.43mm)

14 in stock

PA-SOD3SM18-08

Logical Systems

Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Board Thickness : 0.031" (0.79mm) 1/32"
Material : -
Size / Dimension : 0.450" L x 0.500" W (11.43mm x 12.70mm)

3492 in stock