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Part Number
Manufacturer
Description
Unit Price
In Stock

IPC0041-S IPC0041-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 24
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.197" W (4.00mm x 5.00mm)
Thermal Center Pad : 0.104" L x 0.144" W (2.65mm x 3.65mm)
0
100 in stock

IPC0042-S IPC0042-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : 0.094" L x 0.094" W (2.40mm x 2.40mm)
0
100 in stock

IPC0043-S IPC0043-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.197" W (4.00mm x 5.00mm)
Thermal Center Pad : 0.098" L x 0.138" W (2.50mm x 3.50mm)
0
100 in stock

IPC0044-S IPC0044-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 40
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : 0.138" L x 0.138" W (3.50mm x 3.50mm)
0
100 in stock

IPC0045-S IPC0045-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 46
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.276" W (4.00mm x 7.00mm)
Thermal Center Pad : 0.098" L x 0.217" W (2.50mm x 5.50mm)
0
100 in stock

IPC0046-S IPC0046-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 68
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.315" L x 0.315" W (8.00mm x 8.00mm)
Thermal Center Pad : 0.193" L x 0.193" W (4.90mm x 4.90mm)
0
100 in stock

IPC0047-S IPC0047-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 36
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.630" L x 0.433" W (16.00mm x 11.00mm)
Thermal Center Pad : 0.244" L x 0.630" W (6.20mm x 16.00mm)
0
100 in stock

IPC0048-S IPC0048-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 24
Pitch : 0.039" (1.00mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.630" L x 0.433" W (16.00mm x 11.00mm)
Thermal Center Pad : 0.244" L x 0.630" W (6.20mm x 16.00mm)
0
100 in stock

IPC0049-S IPC0049-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 20
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.630" L x 0.433" W (16.00mm x 11.00mm)
Thermal Center Pad : 0.244" L x 0.630" W (6.20mm x 16.00mm)
0
100 in stock

IPC0050-S IPC0050-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 10
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.295" L x 0.370" W (7.50mm x 9.40mm)
Thermal Center Pad : 0.291" L x 0.413" W (7.40mm x 10.50mm)
0
100 in stock

IPC0051-S IPC0051-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.157" W (5.00mm x 4.00mm)
Thermal Center Pad : 0.089" L x 0.118" W (2.25mm x 3.00mm)
0
100 in stock

IPC0052-S IPC0052-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 4
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.051" L x 0.059" W (1.30mm x 1.50mm)
Thermal Center Pad : -
0
100 in stock