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Part Number
Manufacturer
Description
Unit Price
In Stock
SMD291SNL10T5
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
37 in stock
SMD291SNL15T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 0.53 oz (15g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 77°F (3°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 0.53 oz (15g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 77°F (3°C ~ 25°C)
0
15 in stock
SMD291SNL250T3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
21 in stock
SMD291SNL250T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
16 in stock
SMD291SNL250T5
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
42 in stock
SMD291SNL500T3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
SMD291SNL500T3C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
2 in stock
SMD291SNL500T4C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
SMD291SNL500T5
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
SMD291SNL500T5C
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
100 in stock
SMD291SNL50T3
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 6 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 46°F (3°C ~ 8°C)
0
60 in stock
SMD291SNL60T4
Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 2.12 oz (60g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 77°F (3°C ~ 25°C)
Series : -
Part Status : Active
Type : Solder Paste, Two Part Mix
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 2.12 oz (60g)
Shelf Life : 24 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 37°F ~ 77°F (3°C ~ 25°C)
0
5 in stock
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