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- Connectors, Interconnects
- Sockets for ICs, Transistors
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Part Number
Manufacturer
Description
Unit Price
In Stock
18-6823-90
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
100 in stock
1981837-1
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Tray
Series : -
Part Status : Obsolete
Type : LGA
Number of Positions or Pins (Grid) : 1366 (32 x 41)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 15.0µin (0.38µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.040" (1.01mm)
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
Packaging : Tray
Series : -
Part Status : Obsolete
Type : LGA
Number of Positions or Pins (Grid) : 1366 (32 x 41)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 15.0µin (0.38µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.040" (1.01mm)
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
76 in stock
20-0511-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 511
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : 511
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
1142 in stock
20-0518-00
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
75 in stock
20-0518-10T
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
73 in stock
200-6310-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 100 (10 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 100 (10 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
54 in stock
200-6311-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 121 (11 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 121 (11 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
100 in stock
200-6313-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 169 (13 x 13)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 169 (13 x 13)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
69 in stock
200-6315-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 225 (15 x 15)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : -
Contact Finish Thickness - Mating : -
Contact Material - Mating : -
Mounting Type : -
Features : -
Termination : -
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : -
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 225 (15 x 15)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : -
Contact Finish Thickness - Mating : -
Contact Material - Mating : -
Mounting Type : -
Features : -
Termination : -
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : -
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
142 in stock
200-6317-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 289 (17 x 17)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 289 (17 x 17)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
94 in stock
200-6319-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 361 (19 x 19)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 361 (19 x 19)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
37 in stock
200-6321-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 441 (21 x 21)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 441 (21 x 21)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
29 in stock
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