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- Connectors, Interconnects
- Sockets for ICs, Transistors
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Part Number
Manufacturer
Description
Unit Price
In Stock
200-6325-9UN-1900
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 625 (25 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : 625 (25 x 25)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -55°C ~ 150°C
0
3 in stock
203-2737-55-1102
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Transistor, TO-3 and TO-66
Number of Positions or Pins (Grid) : 3 (Rectangular)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.234" (5.94mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : Transistor, TO-3 and TO-66
Number of Positions or Pins (Grid) : 3 (Rectangular)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.234" (5.94mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -55°C ~ 150°C
0
178 in stock
20-3518-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1810 in stock
20-820-90C
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
36 in stock
20-823-90
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
2432 in stock
208-7391-55-1902
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
0
470 in stock
209-PGM17020-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : PGM
Part Status : Active
Type : PGA
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : PGM
Part Status : Active
Type : PGA
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
19 in stock
210-1-06-003
CnC Tech
Manufacturer : CNC Tech
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 6 (2 x 3)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 6 (2 x 3)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
0
8667 in stock
210-1-08-003
CnC Tech
Manufacturer : CNC Tech
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
0
8203 in stock
210-1-14-003
CnC Tech
Manufacturer : CNC Tech
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
0
645 in stock
210-1-16-003
CnC Tech
Manufacturer : CNC Tech
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
0
2560 in stock
210-1-18-003
CnC Tech
Manufacturer : CNC Tech
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
Packaging : Tube
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT)
Operating Temperature : -40°C ~ 105°C
0
7210 in stock
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