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Part Number
Manufacturer
Description
Unit Price
In Stock
214-99-632-01-670800
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 214
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 32 (2 x 16)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : 214
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 32 (2 x 16)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
1638 in stock
214-99-640-01-670800
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Tube
Series : 214
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : 214
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
71 in stock
2-1571550-4
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 500
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : 500
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
1118 in stock
2-1571550-9
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 500
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : 500
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
7 in stock
2-1571994-0
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Bulk
Series : 510
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Copper
Housing Material : Thermoplastic, Polyester
Operating Temperature : -
Packaging : Bulk
Series : 510
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Copper
Housing Material : Thermoplastic, Polyester
Operating Temperature : -
0
1972 in stock
216-3340-00-0602J
3M
Manufacturer : 3M
Packaging : Tube
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Tube
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
1293 in stock
216-5205-01
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 16 (4 x 4)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 16 (4 x 4)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
0
43 in stock
216-6278-00-3303
3M
Manufacturer : 3M
Packaging : Bulk
Series : OEM
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 250.0µin (6.35µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 250.0µin (6.35µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyether Imide (PEI), Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : OEM
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 250.0µin (6.35µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 250.0µin (6.35µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyether Imide (PEI), Glass Filled
Operating Temperature : -55°C ~ 105°C
0
66 in stock
216-7224-55-1902
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
0
100 in stock
216-7383-55-1902
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SOIC
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES), Glass Filled
Operating Temperature : -55°C ~ 150°C
0
42 in stock
2174988-1
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Bulk
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 2011 (47 x 58)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 15.0µin (0.38µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.035" (0.90mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 15.0µin (0.38µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
Packaging : Bulk
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 2011 (47 x 58)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 15.0µin (0.38µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.035" (0.90mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 15.0µin (0.38µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
290 in stock
2174988-2
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Bulk
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 2011 (47 x 58)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.035" (0.90mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
Packaging : Bulk
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 2011 (47 x 58)
Pitch - Mating : 0.040" (1.02mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.035" (0.90mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
194 in stock
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