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- Connectors, Interconnects
- Sockets for ICs, Transistors
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Part Number
Manufacturer
Description
Unit Price
In Stock
224-1286-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
24 in stock
22-4518-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
127 in stock
22-4518-11
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 22 (2 x 11)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
13 in stock
224-5205-01
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 24 (4 x 6)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : QFN
Number of Positions or Pins (Grid) : 24 (4 x 6)
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : -
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyethersulfone (PES)
Operating Temperature : -
0
18 in stock
224-5248-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
100 in stock
224-5809-00-0602
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 24 (1 x 24)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : SIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 24 (1 x 24)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
100 in stock
225-PRS15001-12
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
0
137 in stock
228-1277-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
249 in stock
228-1290-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.070" (1.78mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
57 in stock
228-1371-00-0602J
3M
Manufacturer : 3M
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : Textool™
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Connector
Features : Closed Frame
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polysulfone (PSU), Glass Filled
Operating Temperature : -55°C ~ 125°C
0
28 in stock
2-2822979-3
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Tray
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 3647
Pitch - Mating : 0.039" (1.00mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.034" (0.86mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
Packaging : Tray
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 3647
Pitch - Mating : 0.039" (1.00mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.034" (0.86mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
54 in stock
2-2822979-4
Agastat Relays / TE Connectivity
Manufacturer : TE Connectivity AMP Connectors
Packaging : Tray
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 3647
Pitch - Mating : 0.039" (1.00mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.034" (0.86mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
Packaging : Tray
Series : -
Part Status : Active
Type : LGA
Number of Positions or Pins (Grid) : 3647
Pitch - Mating : 0.039" (1.00mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.034" (0.86mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 30.0µin (0.76µm)
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic
Operating Temperature : -
0
57 in stock
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