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- Connectors, Interconnects
- Sockets for ICs, Transistors
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Part Number
Manufacturer
Description
Unit Price
In Stock
346-93-116-41-013000
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 16 (1 x 16)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 16 (1 x 16)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
206 in stock
346-93-164-41-013000
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 64 (1 x 64)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 64 (1 x 64)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
628 in stock
346-99-120-41-013000
Mill-Max
Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
Packaging : Bulk
Series : 346
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : -
Termination : Press-Fit
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C
0
45 in stock
361-PRS19001-12
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
0
10 in stock
382
Adafruit
Manufacturer : Adafruit Industries LLC
Packaging : Bulk
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : -
Contact Finish - Mating : -
Contact Finish Thickness - Mating : -
Contact Material - Mating : -
Mounting Type : -
Features : -
Termination : -
Pitch - Post : -
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : -
Housing Material : -
Operating Temperature : -
Packaging : Bulk
Series : -
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : -
Contact Finish - Mating : -
Contact Finish Thickness - Mating : -
Contact Material - Mating : -
Mounting Type : -
Features : -
Termination : -
Pitch - Post : -
Contact Finish - Post : -
Contact Finish Thickness - Post : -
Contact Material - Post : -
Housing Material : -
Operating Temperature : -
0
67 in stock
40-0518-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 40 (1 x 40)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 40 (1 x 40)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
3784 in stock
40-0518-11
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 40 (1 x 40)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 40 (1 x 40)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
100 in stock
40-516-11
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 516
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 516
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
11 in stock
40-526-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
174 in stock
40-6518-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1510 in stock
40-6554-10
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
107 in stock
40-6554-11
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
134 in stock
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