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Part Number

Manufacturer

Description

Unit Price

In Stock

40-6574-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 57
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -

22 in stock

40-6823-90

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -

119 in stock

40-9513-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -

45 in stock

40-C182-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : EJECT-A-DIP™
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C

84 in stock

40-C212-10

Aries Electronics, Inc.

211 in stock

410-93-220-10-001000

Mill-Max

Manufacturer : Mill-Max Manufacturing Corp.
Packaging : Bulk
Series : 410
Part Status : Active
Type : Zig-Zag, Left Stackable
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass Alloy
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C

129 in stock

4-1571551-3

Agastat Relays / TE Connectivity

Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 500
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Nickel
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 125°C

2029 in stock

4-1571552-2

Agastat Relays / TE Connectivity

Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 14 (2 x 7)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 105°C

1967 in stock

4-1571552-4

Agastat Relays / TE Connectivity

Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 16 (2 x 8)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 105°C

1414 in stock

4-1571552-9

Agastat Relays / TE Connectivity

Manufacturer : TE Connectivity AMP Connectors
Packaging : Tube
Series : 800
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 105°C

904 in stock

441-PRS21001-12

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C

40 in stock

44-547-11

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 547
Part Status : Active
Type : SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid) : 44 (2 x 22)
Pitch - Mating : -
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 20.0µin (0.51µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 20.0µin (0.51µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -

5 in stock