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Part Number

Manufacturer

Description

Unit Price

In Stock

A17819-09

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0900" (2.286mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-10

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.100" (2.54mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-11

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.110" (2.79mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-12

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.120" (3.05mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-13

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.130" (3.30mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-14

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.140" (3.56mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-15

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.150" (3.81mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-16

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.160" (4.06mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-17

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.170" (4.32mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-18

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.180" (4.57mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-19

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.190" (4.83mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17819-20

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.200" (5.08mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock