Thermal - Pads, Sheets Products, Stocks, Distributors, Manufactor, Shopping, Company,Electronic Components Online store

Image

Part Number

Manufacturer

Description

Unit Price

In Stock

A17820-04

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0400" (1.016mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-05

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0500" (1.270mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-06

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0600" (1.524mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-07

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0700" (1.778mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-08

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0800" (2.032mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-09

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.0900" (2.286mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-10

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.100" (2.54mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-11

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.110" (2.79mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-12

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.120" (3.05mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-13

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.130" (3.30mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-14

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.140" (3.56mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock

A17820-15

Laird Thermal Materials

Manufacturer : Laird Technologies - Thermal Materials
Series : Tflex™HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.150" (3.81mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K

100 in stock