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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
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Description
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In Stock
Picture of IPC0089-S

IPC0089-S IPC0089-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 22
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.197" W (6.00mm x 5.00mm)
Thermal Center Pad : 0.102" L x 0.213" W (2.60mm x 5.40mm)
0
100 in stock
Picture of IPC0090-S

IPC0090-S IPC0090-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 12
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0091-S

IPC0091-S IPC0091-S

Chip Quik, Inc.
Type : PowerSSOP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.382" L x 0.240" W (9.70mm x 6.10mm)
Thermal Center Pad : 0.162" L x 0.154" W (4.11mm x 3.91mm)
0
100 in stock
Picture of IPC0092-S

IPC0092-S IPC0092-S

Chip Quik, Inc.
Type : PowerSSOP
Number of Positions : 30
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.433" L x 0.240" W (11.00mm x 6.10mm)
Thermal Center Pad : 0.162" L x 0.154" W (4.11mm x 3.91mm)
0
100 in stock
Picture of IPC0093-S

IPC0093-S IPC0093-S

Chip Quik, Inc.
Type : PowerSSOP
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.433" L x 0.240" W (11.00mm x 6.10mm)
Thermal Center Pad : 0.162" L x 0.154" W (4.11mm x 3.91mm)
0
100 in stock
Picture of IPC0094-S

IPC0094-S IPC0094-S

Chip Quik, Inc.
Type : PowerSSOP
Number of Positions : 38
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.492" L x 0.240" W (12.50mm x 6.10mm)
Thermal Center Pad : 0.162" L x 0.154" W (4.11mm x 3.91mm)
0
100 in stock
Picture of IPC0095-S

IPC0095-S IPC0095-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 36
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.236" W (5.00mm x 6.00mm)
Thermal Center Pad : 0.136" L x 0.180" W (3.45mm x 4.57mm)
0
100 in stock
Picture of IPC0096-S

IPC0096-S IPC0096-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 12
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.079" W (2.00mm x 2.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0097-S

IPC0097-S IPC0097-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 48
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.354" L x 0.354" W (9.00mm x 9.00mm)
Thermal Center Pad : 0.268" L x 0.268" W (6.80mm x 6.80mm)
0
100 in stock
Picture of IPC0098-S

IPC0098-S IPC0098-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 28
Pitch : 0.022" (0.55mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0099-S

IPC0099-S IPC0099-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 44
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.315" L x 0.315" W (8.00mm x 8.00mm)
Thermal Center Pad : 0.254" L x 0.254" W (6.45mm x 6.45mm)
0
100 in stock
Picture of IPC0100-S

IPC0100-S IPC0100-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : 0.157" L x 0.157" W (4.00mm x 4.00mm)
0
100 in stock
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