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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
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Description
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In Stock
Picture of IPC0101-S

IPC0101-S IPC0101-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 56
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.354" W (5.00mm x 9.00mm)
Thermal Center Pad : 0.136" L x 0.281" W (3.45mm x 7.13mm)
0
100 in stock
Picture of IPC0102-S

IPC0102-S IPC0102-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 20
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0103-S

IPC0103-S IPC0103-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 10
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.197" W (3.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0104-S

IPC0104-S IPC0104-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 12
Pitch : 0.018" (0.45mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.079" W (3.00mm x 2.00mm)
Thermal Center Pad : 0.025" L x 0.094" W (0.64mm x 2.39mm)
0
100 in stock
Picture of IPC0105-S

IPC0105-S IPC0105-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.197" W (4.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0106-S

IPC0106-S IPC0106-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : 0.102" L x 0.118" W (2.60mm x 3.00mm)
0
100 in stock
Picture of IPC0107-S

IPC0107-S IPC0107-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 24
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.138" L x 0.138" W (3.50mm x 3.50mm)
Thermal Center Pad : 0.087" L x 0.087" W (2.20mm x 2.20mm)
0
100 in stock
Picture of IPC0108-S

IPC0108-S IPC0108-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 20
Pitch : 0.018" (0.45mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.061" L x 0.061" W (1.55mm x 1.55mm)
0
100 in stock
Picture of IPC0109-S

IPC0109-S IPC0109-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 28
Pitch : 0.024" (0.60mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.295" L x 0.173" W (7.50mm x 4.40mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0110-S

IPC0110-S IPC0110-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.138" L x 0.138" W (3.50mm x 3.50mm)
Thermal Center Pad : 0.084" L x 0.084" W (2.14mm x 2.14mm)
0
100 in stock
Picture of IPC0111-S

IPC0111-S IPC0111-S

Chip Quik, Inc.
Type : HSOP
Number of Positions : 44
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.630" L x 0.433" W (16.00mm x 11.00mm)
Thermal Center Pad : 0.270" L x 0.630" W (6.85mm x 16.00mm)
0
100 in stock
Picture of IPC0112-S

IPC0112-S IPC0112-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 24
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.157" W (7.00mm x 4.00mm)
Thermal Center Pad : 0.104" L x 0.253" W (2.64mm x 6.43mm)
0
100 in stock
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