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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of IPC0137-S

IPC0137-S IPC0137-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 60
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.551" L x 0.551" W (14.00mm x 14.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0138-S

IPC0138-S IPC0138-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 64
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.472" L x 0.472" W (12.00mm x 12.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0139-S

IPC0139-S IPC0139-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 80
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.551" L x 0.787" W (14.00mm x 20.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0140-S

IPC0140-S IPC0140-S

Chip Quik, Inc.
Type : SSOP
Number of Positions : 36
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.606" L x 0.295" W (15.40mm x 7.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0141-S

IPC0141-S IPC0141-S

Chip Quik, Inc.
Type : PowerSSO
Number of Positions : 36
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.407" L x 0.295" W (10.35mm x 7.50mm)
Thermal Center Pad : 0.185" L x 0.217" W (4.70mm x 5.50mm)
0
100 in stock
Picture of IPC0142-S

IPC0142-S IPC0142-S

Chip Quik, Inc.
Type : SOP
Number of Positions : 8
Pitch : 0.100" (2.54mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.374" L x 0.261" W (9.50mm x 6.62mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0143-S

IPC0143-S IPC0143-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : 0.106" L x 0.106" W (2.70mm x 2.70mm)
0
100 in stock
Picture of IPC0144-S

IPC0144-S IPC0144-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 56
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : 0.204" L x 0.204" W (5.18mm x 5.18mm)
0
100 in stock
Picture of IPC0145-S

IPC0145-S IPC0145-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 36
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.354" L x 0.354" W (9.00mm x 9.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0146-S

IPC0146-S IPC0146-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 56
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.433" W (5.00mm x 11.00mm)
Thermal Center Pad : 0.096" L x 0.330" W (2.45mm x 8.38mm)
0
100 in stock
Picture of IPC0147-S

IPC0147-S IPC0147-S

Chip Quik, Inc.
Type : HSOP
Number of Positions : 48
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.630" L x 0.346" W (16.00mm x 8.80mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0148-S

IPC0148-S IPC0148-S

Chip Quik, Inc.
Type : PLCC/JLCC
Number of Positions : 4
Pitch : 0.059" (1.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.126" L x 0.110" W (3.20mm x 2.80mm)
Thermal Center Pad : -
0
100 in stock
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