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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
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Description
Unit Price
In Stock
Picture of IPC0161-S

IPC0161-S IPC0161-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 10
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0162-S

IPC0162-S IPC0162-S

Chip Quik, Inc.
Type : SSOP
Number of Positions : 24
Pitch : 0.039" (1.00mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.512" L x 0.236" W (13.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0163-S

IPC0163-S IPC0163-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.803" L x 0.445" W (20.40mm x 11.30mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0164-S

IPC0164-S IPC0164-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 8
Pitch : 0.018" (0.45mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.118" W (2.00mm x 3.00mm)
Thermal Center Pad : 0.065" L x 0.053" W (1.65mm x 1.35mm)
0
100 in stock
Picture of IPC0165-S

IPC0165-S IPC0165-S

Chip Quik, Inc.
Type : SON
Number of Positions : 6
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.079" W (2.00mm x 2.00mm)
Thermal Center Pad : 0.041" L x 0.067" W (1.05mm x 1.70mm)
0
100 in stock
Picture of IPC0167-S

IPC0167-S IPC0167-S

Chip Quik, Inc.
Type : SOP
Number of Positions : 36
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.504" L x 0.295" W (12.80mm x 7.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0168-S

IPC0168-S IPC0168-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 16
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : 0.130" L x 0.154" W (3.30mm x 3.90mm)
0
100 in stock
Picture of IPC0169-S

IPC0169-S IPC0169-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 44
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 1.106" L x 0.520" W (28.10mm x 13.20mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0170-S

IPC0170-S IPC0170-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 24
Pitch : 0.039" (1.00mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.315" L x 0.236" W (8.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0171-S

IPC0171-S IPC0171-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 25
Pitch : 0.039" (1.00mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.315" L x 0.236" W (8.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0172-S

IPC0172-S IPC0172-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.315" W (6.00mm x 8.00mm)
Thermal Center Pad : 0.134" L x 0.169" W (3.40mm x 4.30mm)
0
100 in stock
Picture of IPC0173-S

IPC0173-S IPC0173-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 8
Pitch : 0.038" (0.97mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.155" L x 0.093" W (3.94mm x 2.36mm)
Thermal Center Pad : -
0
100 in stock
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