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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
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Description
Unit Price
In Stock
Picture of IPC0174-S

IPC0174-S IPC0174-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.138" W (4.00mm x 3.50mm)
Thermal Center Pad : 0.081" L x 0.100" W (2.05mm x 2.55mm)
0
100 in stock
Picture of IPC0175-S

IPC0175-S IPC0175-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 20
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.138" W (4.00mm x 3.50mm)
Thermal Center Pad : 0.081" L x 0.100" W (2.05mm x 2.55mm)
0
100 in stock
Picture of IPC0176-S

IPC0176-S IPC0176-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 12
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.067" L x 0.098" W (1.70mm x 2.50mm)
0
100 in stock
Picture of IPC0177-S

IPC0177-S IPC0177-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 48
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.492" L x 0.240" W (12.50mm x 6.10mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0178-S

IPC0178-S IPC0178-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 56
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.551" L x 0.240" W (14.00mm x 6.10mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0179-S

IPC0179-S IPC0179-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 64
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.669" L x 0.240" W (17.00mm x 6.10mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0180-S

IPC0180-S IPC0180-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.098" W (3.00mm x 2.50mm)
Thermal Center Pad : 0.039" L x 0.059" W (1.00mm x 1.50mm)
0
100 in stock
Picture of IPC0181-S

IPC0181-S IPC0181-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 12
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.067" W (2.00mm x 1.70mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0182-S

IPC0182-S IPC0182-S

Chip Quik, Inc.
Type : LGA
Number of Positions : 10
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.061" L x 0.045" W (1.55mm x 1.15mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0183-S

IPC0183-S IPC0183-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 20
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : 0.130" L x 0.154" W (3.30mm x 3.90mm)
0
100 in stock
Picture of IPC0184-S

IPC0184-S IPC0184-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 24
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : 0.130" L x 0.154" W (3.30mm x 3.90mm)
0
100 in stock
Picture of IPC0185-S

IPC0185-S IPC0185-S

Chip Quik, Inc.
Type : PowerSOIC
Number of Positions : 28
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : 0.130" L x 0.154" W (3.30mm x 3.90mm)
0
100 in stock
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