Type : SOIC Number of Positions : 18 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 20 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 24 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOP Number of Positions : 24 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 28 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 32 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 48 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.950" W (22.86mm x 49.53mm) Inner Dimension : - Thermal Center Pad : -
Type : SOIC Number of Positions : 54 Pitch : 0.050" (1.27mm) Outer Dimension : 0.900" L x 1.950" W (22.86mm x 49.53mm) Inner Dimension : - Thermal Center Pad : -
Type : SSOP Number of Positions : 8 Pitch : 0.026" (0.65mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SSOP Number of Positions : 14 Pitch : 0.026" (0.65mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SSOP Number of Positions : 16 Pitch : 0.026" (0.65mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -
Type : SSOP Number of Positions : 20 Pitch : 0.026" (0.65mm) Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension : - Thermal Center Pad : -