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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
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Description
Unit Price
In Stock
Picture of IPC0186-S

IPC0186-S IPC0186-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 24
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.217" L x 0.138" W (5.50mm x 3.50mm)
Thermal Center Pad : 0.081" L x 0.122" W (2.05mm x 3.10mm)
0
100 in stock
Picture of IPC0187-S

IPC0187-S IPC0187-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.217" L x 0.138" W (5.50mm x 3.50mm)
Thermal Center Pad : 0.081" L x 0.122" W (2.05mm x 3.10mm)
0
100 in stock
Picture of IPC0188-S

IPC0188-S IPC0188-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : 0.102" L x 0.079" W (2.60mm x 2.00mm)
0
100 in stock
Picture of IPC0190-S

IPC0190-S IPC0190-S

Chip Quik, Inc.
Type : RN
Number of Positions : 24
Pitch : 0.047" (1.20mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.768" L x 0.453" W (19.50mm x 11.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0191-S

IPC0191-S IPC0191-S

Chip Quik, Inc.
Type : RN
Number of Positions : 32
Pitch : 0.047" (1.20mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 1.016" L x 0.528" W (25.80mm x 13.40mm)
Thermal Center Pad : -
0
100 in stock
Picture of IPC0192-S

IPC0192-S IPC0192-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 36
Pitch : 0.035" (0.90mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.354" L x 0.433" W (9.00mm x 11.00mm)
Thermal Center Pad : 0.122" L x 0.087" W (3.10mm x 2.20mm)
0
100 in stock
Picture of PA0001-S

PA0001-S PA0001-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
8 in stock
Picture of PA0002-S

PA0002-S PA0002-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0003-S

PA0003-S PA0003-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 14
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0004-S

PA0004-S PA0004-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 14
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0005-S

PA0005-S PA0005-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 16
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0006-S

PA0006-S PA0006-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 16
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
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