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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0043-S

PA0043-S PA0043-S

Chip Quik, Inc.
Type : VSOP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0044-S

PA0044-S PA0044-S

Chip Quik, Inc.
Type : VSOP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0045-S

PA0045-S PA0045-S

Chip Quik, Inc.
Type : VSOP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0046-S

PA0046-S PA0046-S

Chip Quik, Inc.
Type : VSOP
Number of Positions : 24
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0047-S

PA0047-S PA0047-S

Chip Quik, Inc.
Type : VSOP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0048-S

PA0048-S PA0048-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 5
Pitch : 0.037" (0.95mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.039" L x 0.197" W (1.00mm x 5.00mm)
0
100 in stock
Picture of PA0049-S

PA0049-S PA0049-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 6
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.079" W (2.00mm x 2.00mm)
Thermal Center Pad : 0.031" L x 0.157" W (0.80mm x 4.00mm)
0
100 in stock
Picture of PA0050-S

PA0050-S PA0050-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.039" L x 0.197" W (1.00mm x 5.00mm)
0
100 in stock
Picture of PA0051-S

PA0051-S PA0051-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.039" L x 0.197" W (1.00mm x 5.00mm)
0
100 in stock
Picture of PA0052-S

PA0052-S PA0052-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.157" W (5.00mm x 4.00mm)
Thermal Center Pad : 0.087" L x 0.276" W (2.20mm x 7.00mm)
0
100 in stock
Picture of PA0053-S

PA0053-S PA0053-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0054-S

PA0054-S PA0054-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 20
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : -
0
100 in stock
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