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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0067-S

PA0067-S PA0067-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0068-S

PA0068-S PA0068-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0069-S

PA0069-S PA0069-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 36
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0070-S

PA0070-S PA0070-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.197" W (7.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0071-S

PA0071-S PA0071-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0072-S

PA0072-S PA0072-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 44
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0073-S

PA0073-S PA0073-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 48
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0074-S

PA0074-S PA0074-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 56
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.315" L x 0.315" W (8.00mm x 8.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0075-S

PA0075-S PA0075-S

Chip Quik, Inc.
Type : TVSOP
Number of Positions : 14
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0076-S

PA0076-S PA0076-S

Chip Quik, Inc.
Type : TVSOP
Number of Positions : 16
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0077-S

PA0077-S PA0077-S

Chip Quik, Inc.
Type : TVSOP
Number of Positions : 20
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0078-S

PA0078-S PA0078-S

Chip Quik, Inc.
Type : TVSOP
Number of Positions : 24
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
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