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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  • Solder Stencils, Templates
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0055-S

PA0055-S PA0055-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0056-S

PA0056-S PA0056-S

Chip Quik, Inc.
Type : MLP/MLF
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0057-S

PA0057-S PA0057-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 8
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0058-S

PA0058-S PA0058-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.039" L x 0.197" W (1.00mm x 5.00mm)
0
100 in stock
Picture of PA0059-S

PA0059-S PA0059-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.138" L x 0.138" W (3.50mm x 3.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0060-S

PA0060-S PA0060-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0061-S

PA0061-S PA0061-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0062-S

PA0062-S PA0062-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 16
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0063-S

PA0063-S PA0063-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 20
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : -
0
8 in stock
Picture of PA0064-S

PA0064-S PA0064-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 24
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.157" W (4.00mm x 4.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0065-S

PA0065-S PA0065-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0066-S

PA0066-S PA0066-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
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