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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0149-S

PA0149-S PA0149-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 60
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.354" L x 0.354" W (9.00mm x 9.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0150-S

PA0150-S PA0150-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 64
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.354" L x 0.354" W (9.00mm x 9.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0151-S

PA0151-S PA0151-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 68
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.394" L x 0.394" W (10.00mm x 10.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0152-S

PA0152-S PA0152-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 4
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.033" L x 0.033" W (0.85mm x 0.85mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0153-S

PA0153-S PA0153-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 5
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.042" L x 0.055" W (1.06mm x 1.39mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0154-S

PA0154-S PA0154-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 6
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.037" L x 0.063" W (0.95mm x 1.61mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0155-S

PA0155-S PA0155-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 8
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.054" L x 0.054" W (1.36mm x 1.36mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0157-S

PA0157-S PA0157-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.089" L x 0.098" W (2.25mm x 2.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0159-S

PA0159-S PA0159-S

Chip Quik, Inc.
Type : BGA
Number of Positions : 14
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.083" L x 0.094" W (2.10mm x 2.40mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0168-S

PA0168-S PA0168-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0169-S

PA0169-S PA0169-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0170-S

PA0170-S PA0170-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.067" L x 0.315" W (1.70mm x 8.00mm)
0
100 in stock
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