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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0171-S

PA0171-S PA0171-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.067" L x 0.315" W (1.70mm x 8.00mm)
0
100 in stock
Picture of PA0172-S

PA0172-S PA0172-S

Chip Quik, Inc.
Type : POS
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.098" W (3.00mm x 2.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0173-S

PA0173-S PA0173-S

Chip Quik, Inc.
Type : PSOP
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.155" L x 0.194" W (3.94mm x 4.93mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0174-S

PA0174-S PA0174-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 3
Pitch : 0.091" (2.30mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.140" L x 0.256" W (3.56mm x 6.50mm)
Thermal Center Pad : 0.079" L x 0.130" W (2.00mm x 3.30mm)
0
100 in stock
Picture of PA0175-S

PA0175-S PA0175-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 4
Pitch : 0.059" (1.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.140" L x 0.256" W (3.56mm x 6.50mm)
Thermal Center Pad : 0.079" L x 0.130" W (2.00mm x 3.30mm)
0
100 in stock
Picture of PA0177-S

PA0177-S PA0177-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 3
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.059" L x 0.039" W (1.50mm x 1.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0178-S

PA0178-S PA0178-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 6
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.059" L x 0.047" W (1.50mm x 1.20mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0179-S

PA0179-S PA0179-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 3
Pitch : 0.037" (0.95mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.059" W (3.00mm x 1.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0180-S

PA0180-S PA0180-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 6
Pitch : 0.037" (0.95mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.059" W (3.00mm x 1.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0181-S

PA0181-S PA0181-S

Chip Quik, Inc.
Type : SOT/SC
Number of Positions : 8
Pitch : 0.037" (0.95mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.157" L x 0.130" W (4.00mm x 3.30mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0182-S

PA0182-S PA0182-S

Chip Quik, Inc.
Type : SSOP
Number of Positions : 16
Pitch : 0.025" (0.64mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0183-S

PA0183-S PA0183-S

Chip Quik, Inc.
Type : TO/DPAK
Number of Positions : 3
Pitch : 0.090" (2.29mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.259" L x 0.287" W (6.58mm x 7.30mm)
Thermal Center Pad : 0.276" L x 0.236" W (7.00mm x 6.00mm)
0
100 in stock
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