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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
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  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0184-S

PA0184-S PA0184-S

Chip Quik, Inc.
Type : TO/DDPAK
Number of Positions : 3
Pitch : 0.100" (2.54mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.400" L x 0.390" W (10.16mm x 9.91mm)
Thermal Center Pad : 0.394" L x 0.433" W (10.00mm x 11.00mm)
0
100 in stock
Picture of PA0185-S

PA0185-S PA0185-S

Chip Quik, Inc.
Type : TO/DDPAK
Number of Positions : 5
Pitch : 0.067" (1.70mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.400" L x 0.390" W (10.16mm x 9.91mm)
Thermal Center Pad : 0.394" L x 0.433" W (10.00mm x 11.00mm)
0
100 in stock
Picture of PA0186-S

PA0186-S PA0186-S

Chip Quik, Inc.
Type : TO/DDPAK
Number of Positions : 7
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.400" L x 0.390" W (10.16mm x 9.91mm)
Thermal Center Pad : 0.370" L x 0.427" W (9.40mm x 10.85mm)
0
100 in stock
Picture of PA0187-S

PA0187-S PA0187-S

Chip Quik, Inc.
Type : TO/DDPAK
Number of Positions : 9
Pitch : 0.038" (0.97mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.400" L x 0.390" W (10.16mm x 9.91mm)
Thermal Center Pad : 0.370" L x 0.427" W (9.40mm x 10.85mm)
0
100 in stock
Picture of PA0188-S

PA0188-S PA0188-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 144
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.787" L x 0.787" W (20.00mm x 20.00mm)
Thermal Center Pad : -
0
12 in stock
Picture of PA0189-S

PA0189-S PA0189-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 176
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.945" L x 0.945" W (24.00mm x 24.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0190-S

PA0190-S PA0190-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 128
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.551" L x 0.551" W (14.00mm x 14.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0191-S

PA0191-S PA0191-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.069" L x 0.354" W (1.75mm x 9.00mm)
0
100 in stock
Picture of PA0192-S

PA0192-S PA0192-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 14
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.173" L x 0.197" W (4.40mm x 5.00mm)
Thermal Center Pad : 0.118" L x 0.433" W (3.00mm x 11.00mm)
0
100 in stock
Picture of PA0193-S

PA0193-S PA0193-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.173" L x 0.197" W (4.40mm x 5.00mm)
Thermal Center Pad : 0.118" L x 0.433" W (3.00mm x 11.00mm)
0
100 in stock
Picture of PA0194-S

PA0194-S PA0194-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 20
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.173" L x 0.256" W (4.40mm x 6.50mm)
Thermal Center Pad : 0.118" L x 0.492" W (3.00mm x 12.50mm)
0
100 in stock
Picture of PA0195-S

PA0195-S PA0195-S

Chip Quik, Inc.
Type : TSSOP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.173" L x 0.382" W (4.40mm x 9.70mm)
Thermal Center Pad : 0.118" L x 0.630" W (3.00mm x 16.00mm)
0
100 in stock
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