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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0211-S

PA0211-S PA0211-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 56
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0212-S

PA0212-S PA0212-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 66
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0213-S

PA0213-S PA0213-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 86
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0214-S

PA0214-S PA0214-S

Chip Quik, Inc.
Type : PLCC/JLCC
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.453" L x 0.551" W (11.50mm x 14.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0216-S

PA0216-S PA0216-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0217-S

PA0217-S PA0217-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 44
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0218-S

PA0218-S PA0218-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 28
Pitch : 0.022" (0.55mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0219-S

PA0219-S PA0219-S

Chip Quik, Inc.
Type : PLCC/JLCC
Number of Positions : 52
Pitch : 0.050" (1.27mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.748" L x 0.748" W (19.00mm x 19.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0220-S

PA0220-S PA0220-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 144
Pitch : 0.016" (0.40mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.630" L x 0.630" W (16.00mm x 16.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0221-S

PA0221-S PA0221-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 128
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.551" L x 0.787" W (14.00mm x 20.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0223-S

PA0223-S PA0223-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 100
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.472" L x 0.472" W (12.00mm x 12.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0224-S

PA0224-S PA0224-S

Chip Quik, Inc.
Type : SOP
Number of Positions : 40
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.950" W (22.86mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
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