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LM358ATMEGA328P2N7002 78M05 W5500STM32F103C8T6
Category
  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0225-S

PA0225-S PA0225-S

Chip Quik, Inc.
Type : LSOP
Number of Positions : 10
Pitch : 0.063" (1.60mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0226-S

PA0226-S PA0226-S

Chip Quik, Inc.
Type : SSOP
Number of Positions : 56
Pitch : 0.025" (0.64mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0227-S

PA0227-S PA0227-S

Chip Quik, Inc.
Type : SSOP
Number of Positions : 48
Pitch : 0.025" (0.64mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0228-S

PA0228-S PA0228-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0229-S

PA0229-S PA0229-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 56
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.950" W (22.86mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0230-S

PA0230-S PA0230-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 56
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.394" L x 0.394" W (10.00mm x 10.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0235-S

PA0235-S PA0235-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 40
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0237-S

PA0237-S PA0237-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 36
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0238-S

PA0238-S PA0238-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 44
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.950" W (22.86mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0239-S

PA0239-S PA0239-S

Chip Quik, Inc.
Type : SOIC
Number of Positions : 44
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock
Picture of PA0240-S

PA0240-S PA0240-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 48
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.394" L x 0.394" W (10.00mm x 10.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0241-S

PA0241-S PA0241-S

Chip Quik, Inc.
Type : TQFP
Number of Positions : 52
Pitch : 0.039" (1.00mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.551" L x 0.551" W (14.00mm x 14.00mm)
Thermal Center Pad : -
0
100 in stock
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